JYOTI RANI; K. J. SINGH; SINGH, R. . Prediction of Effective Thermal Conductivity of Cu/Solder System by Using Interfacial Layer in Two Phase System. Asian Journal of Engineering and Applied Technology, [S. l.], v. 3, n. 2, p. 16–18, 2014. DOI: 10.51983/ajeat-2014.3.2.712. Disponível em: https://ojs.trp.org.in/index.php/ajeat/article/view/712. Acesso em: 3 jul. 2024.