Prediction of Effective Thermal Conductivity of Cu/Solder System by Using Interfacial Layer in Two Phase System
DOI:
https://doi.org/10.51983/ajeat-2014.3.2.712Keywords:
Effective thermal conductivity (ETC), real two phase system, correction term, interfacial layer,, resistor model,, metal foam.Abstract
A theoretical model is presented to predict effective thermal conductivity of real two phase materials from the values of thermal conductivity of the constituent phases and their volume fraction. Here we develop a numerical expression for effective thermal conductivity of Cu-solder system in two phase system is being comprised of contributions from both the phases with interfacial layer. A new correlation term F is introduced for highly conducting phase, non-linear fl ow of heat fl ux lines and random distribution of the phases. Here, we get best fi tting relation for F. Comparison of the proposed relation with different models has also been made. The values predicted by the proposed model are in close and good agreement with experimental values and more accurate than those obtained from existing models.
References
A. A. Babanov, "Method of calculation of thermal conduction coefficient of capillary porous material," Sov. Phys. Tech. Phys., vol. 2, pp. 476-484, 1957.
A. D. Brailsford and K. G. Major, "The thermal conductivity of aggregates of several phases including porous materials," Brit. J. Appl. Phys., vol. 15, pp. 313, 1964.
R. N. Pande, "Dependence of effective thermal conductivity on source geometry," Ind. J. Pure Appl. Phys., vol. 26, no. 12, pp. 691–695, 1988.
G. R. Hadley, "Thermal conductivity of packed metal powders," Int. J. Heat Mass Transfer, vol. 20, pp. 909, 1986.
N. Oshima and N. Watari, "The calculation of effective thermal conductivity of media with regularly dispersed parallel cylinders," Jpn. Soc. Mech. Eng. Int. J., vol. 32, pp. 225, 1989.
L. S. Verma, A. K. Shrotriya, R. Singh, and D. R. Chaudhary, "Thermal conduction in two-phase materials with spherical and nonspherical inclusions," J. Phys. D: Appl. Phys., vol. 24, pp. 1729–1737, 1991.
M. Kaviany, Principles of Heat Transfer in Porous Media. Springer, New York, 1991.
V. V. Calmidi, "Transport phenomena in high porosity metal foams," Ph.D. dissertation, University of Colorado, Boulder, CO, 1998.
C. T. Hsu, P. Cheng, and K. W. Wong, "A lumped parameter model for stagnant thermal conductivity of spatially periodic porous media," ASME J. Heat Transfer, vol. 117, pp. 264–269, 1995.
S. Whitaker, The Method of Volume Averaging. Kluwer Academic Publishers, Boston, 1999.
B. Alazmi and K. Vafai, "Analysis of variants within the porous media transport models," ASME J. Heat Transfer, vol. 122, pp. 303–326, 2000.
A. D. Sullins and K. Daryabeigi, "Effective thermal conductivity of high porosity open cell nickel foam," in 35th AIAA Thermo-physics Conference, 2001, pp. 2819, Anaheim, CA.
V. V. Calmidi and R. L. Mahajan, "The effective thermal conductivity of high porosity fibrous metal foams," ASME J. Heat Transfer, vol. 121, pp. 466–471, 1999.
K. Boomsma and D. Poulikakos, "On the effective thermal conductivity of a three dimensionally structured fluid saturated metal foam," Int. J. Heat Mass Transfer, vol. 44, pp. 827–836, 2001.
R. Singh and H. S. Kasana, "Computational aspects of effective thermal conductivity of high porous metal foams," Appl. Therm. Eng., vol. 24, pp. 1841-1849, 2004.
A. Bhattacharya, V. V. Calmidi, and R. L. Mahajan, "Thermophysical properties of high porosity metal foams," Int. J. Heat Mass Transfer, vol. 45, pp. 1017–1031, 2002.
H. J. Lee and R. E. Taylor, "Applied Physics," vol. 47, pp. 148, 1976.
K. C. Leong, C. Yang, and S. Murshed, "A model for the thermal conductivity of nanofluids—the effect of interfacial layer," J. Nanopart. Res., vol. 8, pp. 245, 2006.
R. Singh and Jagjiwanram, "Effective Thermal Conductivity of two phase systems with cylindrical inclusions," Indian J. of Pure & Applied Physics, vol. 42, pp. 600-609, 2004.
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